Toshiba’s Backlit Image Sensor, Great For Low Light Photography

By John Kim | October 29th, 2009

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Toshiba Corporation has launched their new image sensor which is 14.6 megapixel and is back lit. What this means is that images that use High ISO will have finer grains due to the BSI (back-side illumination) technology. The new image sensor will be in mass production in 2010, and will be incorporated into digital cameras and mobile phones everywhere.

If you are a photographer, you have probably had experience with capturing shots in low light conditions. By the time you bring your images home, they are all riddled with grain and noise. Grain can look great for a gritty feel to your photos, but when you are capturing events in low lit banquet halls, that’s the last thing you want. I personally avoid ISO’s higher than 800 because of the large grain size, and I usually use software to make the grains that are visible much finer. Hopefully with this BSI technology, I can save time in my post processing work, and not have that feeling of dread when I’m in low light environments. Please Toshiba, launch this sensor before the purchase of my next upgrade Camera, it will be greatly freaking appreciated.

Press Release

Toshiba Corporation (TOKYO: 6502) today announced the launch of a new CMOS image sensor that will bring 14.6 million pixels to digital still cameras and to mobile phones supporting video imaging. The sensor, the latest addition to Toshiba’s “Dynastron™” line-up, is also the company’s first to integrate the enhanced sensitivity offered by back-side illumination technology (BSI). Sampling of the new sensor will begin in December and mass production will follow from the third quarter of 2010 (July–September).

BSI brings new levels of responsiveness to CMOS imaging. Lenses are deployed on the rear of the sensor on the silicon substrate, not on the front, where wiring limits light absorption. This positioning boosts light sensitivity and absorption by 40% compared to existing Toshiba products, and allows formation of finer image pixels.

Toshiba has made full use of the advantages of BSI to realize image pixels with a pitch of 1.4 microns, and to pack 14.6 million of them into a 1/2.3-inch sensor that meets the high level imaging and processing requirement, and that will also bring a new level of image quality to mobile phones. Toshiba will use the new sensor to promote its full-scale entry to digital camera market, and will continue to develop BSI products as a mainstream technology.

The new sensor will be mass produced at Toshiba’s Oita Operations, on industry leading 300mm wafer lines deploying 65nm process technology. Initial production will be at a volume of 500,000 sensors a month.

CMOS image sensors are a focus product of Toshiba’s System LSI business. Until now, their main application has been in mobile phones, where Toshiba could leverage its high density integration and low power consumption technologies. With the introduction of BSI CMOS sensors, Toshiba will reinforce the sensor business by expanding application to include digital cameras.